Complete embedded electronics engineering — from 8-bit microcontrollers to 64-bit Linux systems, FPGA design, multi-layer PCBs optimised for AI, hardware accelerators and full custom product R&D.
We design embedded systems and custom electronics that form the foundation of intelligent products. Our expertise spans the full range of computing platforms — from ultra-low-power 8-bit microcontrollers to high-performance 64-bit systems running Linux or Windows — and includes advanced FPGA design, multi-layer PCB engineering and AI-oriented hardware acceleration.
Every design is developed with manufacturability, signal integrity, power efficiency, thermal performance and long-term reliability in mind. We support both prototype and production-intent designs, including full custom product development and R&D projects.
From the simplest microcontroller to complex multi-core and FPGA systems.
Ultra-low-power and cost-optimised designs using PIC, AVR, 8051-class, MSP430 and similar devices. Ideal for simple control, sensing, battery-powered and high-volume products.
ARM Cortex-M (STM32, NXP, Nordic, Infineon), ESP32, Renesas and other modern 32-bit MCUs. Real-time control, connectivity, sensor fusion and moderate AI (TinyML) applications.
ARM Cortex-A, NXP i.MX, Rockchip, Qualcomm and similar platforms. High-performance edge computing, multimedia, complex UI and full operating system support.
Custom logic, high-speed interfaces, signal processing, hardware acceleration and real-time control using Xilinx / AMD, Intel (Altera) and Lattice FPGAs. HDL development (VHDL/Verilog) and high-level synthesis.
Custom Linux distributions (Yocto, Buildroot), real-time Linux, Windows IoT / Embedded, driver development, board support packages (BSP) and system optimisation.
Integration of NPUs, TPUs, DSPs and custom FPGA accelerators. Board-level design optimised for AI inference workloads, including power delivery, high-speed memory and thermal design.
From simple single-layer boards to complex high-density multi-layer designs.
Designs ranging from single-layer and double-layer boards up to 8-layer, 12-layer and 16-layer high-density interconnect (HDI) PCBs for complex systems.
PCBs specifically engineered for AI applications and hardware accelerators — controlled impedance, high-speed differential pairs, power integrity, EMI/EMC and thermal management.
Careful stack-up design, length matching, via optimisation, decoupling strategy and simulation-driven layout for reliable high-speed and mixed-signal performance.
DFM/DFA rules, component selection for availability, test-point strategy, panelisation and production-ready documentation for prototype and volume manufacturing.
Full custom electronics development for new products and research projects.
Complete board-level design for new products — from concept architecture through schematic, layout, prototype and production support.
Feasibility studies, technology evaluation, proof-of-concept boards, experimental platforms and iterative R&D electronics support.
Selection of the optimal computing platform (MCU vs MPU vs FPGA vs hybrid), memory, storage, power architecture and interfaces.
Bare-metal and RTOS firmware (FreeRTOS, Zephyr), Linux BSPs, bootloaders, drivers and low-level system software.
Altium Designer, KiCad, OrCAD, Eagle — professional multi-layer and high-speed design flows
Vivado, Quartus, Lattice Radiant / Diamond, ModelSim / Questa, high-level synthesis tools
STM32Cube, MCUXpresso, ESP-IDF, Yocto, Buildroot, Visual Studio, VS Code + PlatformIO
Signal integrity simulation, power integrity, thermal analysis, design rule checking and prototype validation
From a simple 8-bit controller board to a complex multi-layer AI accelerator system — we design electronics that perform.
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